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October 1998

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Subject:
Through Hole Component leads & their solder land size
From:
Ken Fong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Oct 1998 17:41:11 EST
Content-Type:
text/plain
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text/plain (22 lines) 
     Hi, Technetters,

     Can anyone advise where I can find some standards describing the
     relationship between the size of soldering land and the lead
     diameter/thickness of through hole components for wavesoldering and
     handsoldering process?

     Regards,
     KenF

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