We've encountered delamination of multilayer board after reflow
     soldering due to expansion of moisture trapped inside inner layer of
     the PCB. Does IPC has guideline for baking PCB before reflow to
     prevent this?

     Thanks and regards,
     Ken Fong


______________________________ Reply Separator _________________________________
Subject: [TN] Component Baking Guideline
Author:  ,"TechNet E-Mail Forum." <[log in to unmask]>,                Ken Patel
<[log in to unmask]> at Internet
Date:    10/14/98 1:51 AM


Does IPC has guideline for component baking?  If any in the process, please
let me know too.

re,
Ken Patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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