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October 1998

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Subject:
FW: [TN] Voiding in BGA
From:
Jeff Perkins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Oct 1998 09:54:00 -0400
Content-Type:
text/plain
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text/plain (49 lines) 
Florencio,
        Voids in PBGA-WB components (ie. components where there is significant
decoupling between the die CTE and the substrate CTE) can be quite
forgiving.  The eutectic solder balls, even with large amounts of voiding,
can have a fatigue life comparable to balls without voids.
        Expect components with a higher CTE differential to the card (ie. CBGA,
etc.), to be more susceptible to void levels.

        Jeff Perkins
        Photocircuits

-----Original Message-----
From:   Florencio Eiranova [SMTP:[log in to unmask]]
Sent:   Wednesday, October 07, 1998 4:39 PM
To:     [log in to unmask]
Subject:        [TN] Voiding in BGA

To all:
Is there a specification to address the maximum voiding allowed
for PBGA and CBGA solder joints attached to FR-4 substrate ?
Can anybody share some personal experiences in this matter ?
Thanks

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