Steve,
In running my DOE I didn't vary mesh size or metal percentage.  They
were held fixed for other considerations.  I also used commercially
formulated pastes, however in talking to vendors who's pastes performed
the worst I found they were using high temp solvents in their fluxes.

Jim

>-----Original Message-----
>From:  Stephen R. Gregory [SMTP:[log in to unmask]]
>Sent:  Thursday, October 08, 1998 8:15 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] Voiding in BGA
>
>In a message dated 10/8/98 6:00:43 AM Pacific Daylight Time,
>[log in to unmask] writes:
>
><< Rod/Bill
> I concur with those numbers as a worst case.  Actually 20% max (5 - 10%
> nom) can be pretty easily achieved with the correct thermal profiles and
> the correct paste selection.  Boiling point of the paste volatiles plays
> a large part.
> Jim Kittel >>
>
>Hi Jim!
>
>     Can I ask what's desireable? Lower boiling point temperatures? Also,
>does
>mesh size and/or percentage of metals in your paste play any role? Thanks!
>
>-Steve Gregory-
>
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