Item Subject: [TN] BGA
     Hi Tom,

     Sorry about the late response, if you're really in a tight corner you
     may try this approach:

     1) Using micro stencil screen print the through hole pads.
     2) Place the component - if the paste doesn't hold it tape it with
     Kapton tape, the bottoming of the spheres in the t/h pads should
     prevent lateral drift.
     3) Wavesolder.

     Not a very productionised method (who cares when you're backed in a
     corner!) but hopefully the paste will provide intimate contact to the
     pads taking away coplanarity concerns. enabling capillary action to
     take place.

     Anyway it would be interesting to see what happens!!

     Regards Iain.


______________________________ Reply Separator _________________________________
Subject: [TN] BGA
Author:  tomh3 ([log in to unmask]) at Internet,Shar
Date:    10/13/98 8:28 PM


                   *** WARNING ***

This mail has originated outside your organization,
either from an external partner or the Global Internet.
     Keep this in mind if you answer this message.


Hi everyone

A board was design to install a PBGA device using a BGA socket.  After
manufacturing and testing of the prototype, they discovered that the
socket was eminating too much noise.  Now they would like to install it
right on the board bypassing the usage of a socket.  Problem is that the
pads were designed for thru-hole socket.

Question:

1.  Is it viable to install PBGA on thru hole pad(i.e. solder joint, and
reliability)?
2.  Can I install the device w/o solder paste(i.e. flux and eutectic
solder of PBGA)?
3.  How can I align the device on the board?


Any input would be greatly appreciated.

Tom Han
Ardent Systems

___________________________________________________________________
You don't need to buy Internet access to use free Internet e-mail.
Get completely free e-mail from Juno at http://www.juno.com
or call Juno at (800) 654-JUNO [654-5866]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text
 in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for
additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700
ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################