Hi everyone

A board was design to install a PBGA device using a BGA socket.  After
manufacturing and testing of the prototype, they discovered that the
socket was eminating too much noise.  Now they would like to install it
right on the board bypassing the usage of a socket.  Problem is that the
pads were designed for thru-hole socket.

Question:

1.  Is it viable to install PBGA on thru hole pad(i.e. solder joint, and
reliability)?
2.  Can I install the device w/o solder paste(i.e. flux and eutectic
solder of PBGA)?
3.  How can I align the device on the board?


Any input would be greatly appreciated.

Tom Han
Ardent Systems

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