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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 7 Oct 1998 15:47:50 -0600 |
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I've never seen an exact number for voiding, but would be interested if anyone
does have one. As for personal experience, we have seen cases where a single
large void or many small voids aligned at an interface negatively impacted the
reliablility. Also, we saw a case where some degree of voiding actually
increased the life of BGA's, most likely due to some sort of crack arrest
mechanism. I would imagine that a good number for max. voiding would need to
include not just % void, but also position in the joint.
My $0.02,
Rod Martens
-----Original Message-----
From: Non-HP-FEiranova
/hp-ftcollins,[log in to unmask]
Sent: Wednesday, October 07, 1998 2:39 PM
To: Non-HP-TechNet /hp-ftcollins,[log in to unmask]
Cc: Non-HP-FEiranova /hp-ftcollins,[log in to unmask]
Subject: [TN] Voiding in BGA
To all:
Is there a specification to address the maximum voiding allowed
for PBGA and CBGA solder joints attached to FR-4 substrate ?
Can anybody share some personal experiences in this matter ?
Thanks
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