Brian, et al...
There has been considerable discussion of this topic on the TechNet forum.  Before
you reinvent the wheel, I invite you to go to http://jefry.ipc.org/archives/ and do a
search.  Jack

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>>> Brian Rusten <[log in to unmask]> 10/11/98 10:28PM >>>
Dear Designing Folk

One of our PCB Manufacturers has recently started using the "Omikron"
(Immersion White Tin) process as an alternative to Hot Air Leveling.
They are asking us (the designers) whether they can use it for our boards.

Does anyone know of any particular adverse design implications of using
this process? Do you know (even as hearsay) of any problems with the
process?

I know this isn't really a Designer Council question, but then I thought :
"What the hell. These people probably know about it, and don't feel the
need to show off their chemistry degree in their answer." (You can tell
I've spent some time reading the TechNet list, can't you?)

[Even so, I will ask this question of the TechNettes, just leaving out
some of the editorial content]

Thanks, and Regards

Brian Rusten

Contract PCB Design Engineer
JNA Telecommunications Ltd  Ph (02) 9935 5777      Fax (02) 9417 3862
(Now "A Lucent Company")

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