Subject: | |
From: | |
Reply To: | DesignerCouncil E-Mail Forum. |
Date: | Mon, 12 Oct 1998 13:28:55 +1000 |
Content-Type: | TEXT/PLAIN |
Parts/Attachments: |
|
|
Dear Designing Folk
One of our PCB Manufacturers has recently started using the "Omikron"
(Immersion White Tin) process as an alternative to Hot Air Leveling.
They are asking us (the designers) whether they can use it for our boards.
Does anyone know of any particular adverse design implications of using
this process? Do you know (even as hearsay) of any problems with the
process?
I know this isn't really a Designer Council question, but then I thought :
"What the hell. These people probably know about it, and don't feel the
need to show off their chemistry degree in their answer." (You can tell
I've spent some time reading the TechNet list, can't you?)
[Even so, I will ask this question of the TechNettes, just leaving out
some of the editorial content]
Thanks, and Regards
Brian Rusten
Contract PCB Design Engineer
JNA Telecommunications Ltd Ph (02) 9935 5777 Fax (02) 9417 3862
(Now "A Lucent Company")
################################################################
DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE DesignerCouncil <your full name>
To unsubscribe: SIGNOFF DesignerCouncil
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|