Council Members:
     Here is an SMT question?

     We are currently working on stencil design guidelines (aperture size,
aperture shape, stencil thickness, stencil materials, coatings, etc) for
solder paste printing.  Does anybody know of any industry standards, or
previous experimentation that might help us?  We are particularly
interested in the aperture design and stencil thickness for fine pitch
components (less than 20 mils).

Also, we are interested in knowing whether stencil designs vary according
to the use of water soluble versus "no-clean" paste?

Your comments and direction would be greatly appreciated.

-Teo Tijerina

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