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Wed, 21 Oct 1998 15:38:44 +0000 |
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Are you really looking for thermal aging data of 63/37 solder at 187
C? It reflows at 182 C, so it is a liquid (or mix of solid and
liquid, depending on the exact composition of your solder) at 187 C.
For a bunch of charts on the effect of temperature on the tensile
strength of Sn-Pb eutectic, try Chapter 3 of the book Solder
Mechanics: A state of the art assessment, edited by Frear, published
by TMS.
A word of warning: These charts only give you the strength of the
solder joint initially at elevated temperatures. Thermal aging for
any significant amount of time will change the solder's properties.
An example I remember from an experiment I performed a few years ago
in grad school: The shear strength of a solder joint dropped 20%
after a week of aging at 100 C. You may be really looking for
thermal cycling data, some of which you may be able to find in the
aforementioned book.
Good luck - hope this helps you out.
Brett Goldstein
EVI, Inc.
>
> > -----Original Message-----
> > From: Malli, Reggie [SMTP:[log in to unmask]]
> > Sent: Tuesday, October 20, 1998 4:44 PM
> > To: [log in to unmask]
> > Subject: [TN] Thermal Aging Of Solder Joints
> > Importance: High
> >
> > Hello there!
> > I'ld like to get some information regarding the thermal
> > aging of solder joints, particularly with the following conditions:
> >
> > 1. Solder used:
> > 63/37 and 96/04 (4% silver)
> >
> > 2. Product operating temperature; 187C
> >
> > What I'm really looking for is the behaviour of solder joint
> > strength as a function of temperature. If you have any related reports or
> > literature, please email it to me or link me to the source.
> >
> > Thanks for your help,
> >
> > Sincerely,
> >
> > Reggie Malli
> > Manager Process Engineering
> > Glenayre Manufacturing Ltd.
> > Phone: 604-293-1611
> > Fax: 604-293-4390
> > Email: [log in to unmask]
> >
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