Are you really looking for thermal aging data of 63/37 solder at 187 C? It reflows at 182 C, so it is a liquid (or mix of solid and liquid, depending on the exact composition of your solder) at 187 C. For a bunch of charts on the effect of temperature on the tensile strength of Sn-Pb eutectic, try Chapter 3 of the book Solder Mechanics: A state of the art assessment, edited by Frear, published by TMS. A word of warning: These charts only give you the strength of the solder joint initially at elevated temperatures. Thermal aging for any significant amount of time will change the solder's properties. An example I remember from an experiment I performed a few years ago in grad school: The shear strength of a solder joint dropped 20% after a week of aging at 100 C. You may be really looking for thermal cycling data, some of which you may be able to find in the aforementioned book. Good luck - hope this helps you out. Brett Goldstein EVI, Inc. > > > -----Original Message----- > > From: Malli, Reggie [SMTP:[log in to unmask]] > > Sent: Tuesday, October 20, 1998 4:44 PM > > To: [log in to unmask] > > Subject: [TN] Thermal Aging Of Solder Joints > > Importance: High > > > > Hello there! > > I'ld like to get some information regarding the thermal > > aging of solder joints, particularly with the following conditions: > > > > 1. Solder used: > > 63/37 and 96/04 (4% silver) > > > > 2. Product operating temperature; 187C > > > > What I'm really looking for is the behaviour of solder joint > > strength as a function of temperature. If you have any related reports or > > literature, please email it to me or link me to the source. > > > > Thanks for your help, > > > > Sincerely, > > > > Reggie Malli > > Manager Process Engineering > > Glenayre Manufacturing Ltd. > > Phone: 604-293-1611 > > Fax: 604-293-4390 > > Email: [log in to unmask] > > > > ################################################################ > > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > > ################################################################ > > To subscribe/unsubscribe, send a message to [log in to unmask] with > > following text in the body: > > To subscribe: SUBSCRIBE TechNet <your full name> > > To unsubscribe: SIGNOFF TechNet > > ################################################################ > > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > > section for additional information. > > For technical support contact Hugo Scaramuzza at [log in to unmask] or > > 847-509-9700 ext.312 > > ################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################