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September 1998

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Subject:
From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Sep 1998 15:35:18 +0200
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Hi Technet,

I'm looking for an adhesive that can be used for keeping heavy components in place during double sided reflow soldering. Up to now we're using PC-flexmask (the latex-type mask that is normally used for wave soldering) but this material needs a couple of hours to cure, and cannot withstand  the cleaning of intermediate  paste-misprints. 
The adhesive should have  following properties :
- fast curing, preferably at room temperature.
- withstanding soldering temperatures and cleaning (in aliphatic hydrocarbon solvent)
- easy to remove after assembly, although visible residues are acceptable
- adhering to plastic and ceramic parts, and to solderresist
- nonconductive, non corrosive
Any suggestions ?

Daan Terstegge
Signaal Communications
* Unclassified *

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