All,

     Can anyone supply typical values for the following thermal properties
     of Biphenol Resins, as used for PED/PEM (particularly surface mount
     package) moulding compounds?

     I've searched all my usual sources, but only have figures for the
     (more common?) Epoxy Cresol Novalac Resins:

     Moulding Compound:         TCE:          Therm.Cond:        Tg:
                         (ppm x 10^6/degC)     (W/mdegC)       (degC)
     ----------------------------------------------------------------------
     Epoxy Cresol                16               0.67          155
       Novalac Resin      (some up to 20)                 (some up to 200)


     Biphenol Resin              ?                 ?             ?


     Thanks for any figures/information,

     Regards all,

     Clive ffitch
     Matra BAe Dynamics (UK)
     Stevenage, England

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