 
| Sender: |
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| Date: |
Thu, 3 Sep 1998 11:36:53 -0400 |
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1.0 |
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7bit |
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text/plain; charset=us-ascii |
| Organization: |
Phoenix Engineering Design, Inc. |
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Mornin' all-
Is there an IPC spec which relates to how large, location, etc. of
solder balls that are located around, under, near components. I realize
this signifies a process error, and I think I have solved it. However,
I am still curious if IPC regulates this or not.
Ryan Jennens
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