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September 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Thu, 24 Sep 1998 15:49:27 -0700
Reply-To:
[log in to unmask]
Subject:
Solder Balls
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
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text/plain; charset=us-ascii
Organization:
Top Line Electronics Co.
From:
Denise Nguyen <[log in to unmask]>
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text/plain (21 lines) 
To Whom It May Concern,
I am currently working for a contract manufacturing.  Recently, we
change to no-clean process leave many solder balls.  I would like to
know what is IPC specification and reference manual?
Thank you for your consideration.
Denise Nguyen
Manufacturing Engineer
Top Line Electronics

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