Mime-Version: |
1.0 |
Sender: |
|
Subject: |
|
From: |
|
Date: |
Mon, 14 Sep 1998 04:27:00 +0200 |
Content-Type: |
multipart/mixed; boundary="---- =_NextPart_000_01BDDF87.50FABED0" |
X-To: |
|
Reply-To: |
|
Parts/Attachments: |
|
|
The IPC refers to it as HDIS or Highdensity interconnect substrates.
HDI is actually a registered trademark of GE , SLC is a registered
trademark of IBM , Another common useage in the States is also SBU for
sequential buildup, A few folks out there use the term BUM , but most
people agree that is a bad name to give to a product of process, as in
"it's a bummer dude"
----------
From: Joe Malley
To: [log in to unmask]
Subject: Re: [TN] Buildup Wiring Boards
Date: Friday, September 11, 1998 5:19PM
Joe G Malley@MACDERMID
09/11/98 11:19 AM
Warren,
I most often see this technology written as "build-up board" in the U.S.
although I saw many other spellings/acronyms when I was working in
Japan.
Other terms used were: "SLC" - (sequentially laminated circuits?) used
first by IBM in Yasu, Japan; "HDI" for high density interconnects, and
"microvia" technology which seems recently to be gaining in popularity.
Joe Malley
MacDermid Incorporated
"Dr. Warren Smith" <[log in to unmask]> on 09/10/98 10:08:16 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
respond
to "Dr. Warren Smith" <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Joe G Malley/MacDermid/MACDERMID/US)
Subject: [TN] Buildup Wiring Boards
This ought to be a very simple question, but I have spent an hour on the
web
trying to find the answer unsuccessfully --
What is the proper spelling of "buildup wiring board" ("build up wiring
board"; "build-up wiring board")?
Thanks.
Warren Smith
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with
following
text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section
for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
################################################################
|
|
|