The IPC refers to it as HDIS or Highdensity interconnect substrates. HDI is actually a registered trademark of GE , SLC is a registered trademark of IBM , Another common useage in the States is also SBU for sequential buildup, A few folks out there use the term BUM , but most people agree that is a bad name to give to a product of process, as in "it's a bummer dude" ---------- From: Joe Malley To: [log in to unmask] Subject: Re: [TN] Buildup Wiring Boards Date: Friday, September 11, 1998 5:19PM Joe G Malley@MACDERMID 09/11/98 11:19 AM Warren, I most often see this technology written as "build-up board" in the U.S. although I saw many other spellings/acronyms when I was working in Japan. Other terms used were: "SLC" - (sequentially laminated circuits?) used first by IBM in Yasu, Japan; "HDI" for high density interconnects, and "microvia" technology which seems recently to be gaining in popularity. Joe Malley MacDermid Incorporated "Dr. Warren Smith" <[log in to unmask]> on 09/10/98 10:08:16 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to "Dr. Warren Smith" <[log in to unmask]> To: [log in to unmask] cc: (bcc: Joe G Malley/MacDermid/MACDERMID/US) Subject: [TN] Buildup Wiring Boards This ought to be a very simple question, but I have spent an hour on the web trying to find the answer unsuccessfully -- What is the proper spelling of "buildup wiring board" ("build up wiring board"; "build-up wiring board")? Thanks. Warren Smith ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################