Charlie,
        Consider going to a gold board. We've been doing it on some fine
pitch fabs with excellent results, no bridging even with 1:1 aperture
ratios. See ya later....

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

> -----Original Message-----
> From: Charles Barker [SMTP:[log in to unmask]]
> Sent: Thursday, August 20, 1998 8:03 PM
> To:   [log in to unmask]
> Subject:      [TN] Help needed: Attaching leadless ceramic smd
>
> Hi there fellow Techies!
>      I need some advice/suggstions please. We need to attach a custom
> leadless ceramic device to a board. The device is about .5" square
> with
> rounded off corners and has .025" pitch gold solder to pads on the
> bottom
> side only. The attachment surface does not run up the side of the
> device in
> the fashion of a normal castellation found on regular leadless ceramic
> packages.  These pads are .016 x .042 by about .002" thick.
>      The boards are hasl finished. The pads on the board are .016" x
> .053".
> The first attempt at soldering these was made using a .006" thick
> stencil.
> That produced all leads shorted together. The next run was with a
> .004"
> thick setncil. We still experienced some bridging.
>      Have any of you worked with such a device and/or do you have any
> suggestions on the most reliable way to solder such a critter to a
> board?
>
> Thanks in advance!
>
> Charlie Barker
> [log in to unmask]
> 281-552-3328
>
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