I've used them off and on in the past, both for potting and removable
masking.
Problem, the material is hot and has low thermal conductivity. It can
thermal shock parts.
Problem, the material does flow and move in many applications.
Problem, it is difficult to repeatably process in volume without stringing.
It is very inexpensive and easy to use.
I have never had much success in volume production when using it as potting
material. Accuracy, air pockets (from high viscosity and fast setup),
stringing, poor temperature control affecting flow rate, and high
temperature requiring gloves.
ARIC PARR
Sr. Manufacturing Engineer
Eaton Corp
1400 S. Livernois
P. O. Box 5020
Rochester Hills, Mi 48308-5020
[log in to unmask]
248 608 7780
Fax: 248 656 2242
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 8/5/98 10:01 AM:
To: Aric Parr@01635@Lectron_RH,
EatonWHQ@CorpMail@WHQCleveOH[C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG]
Hi Folks,
I have been playing around with some hot-melt adhesives and am somewhat
surprised at how well some of them bond to wire insulation, board materials,
etc. I really don't know anyone in the government or aerospace biz that is
using this bonding or potting method, and I am wondering 'how come?'
there
may be some very obvious reasons for this, and I'd like to know them. OR,
if
anyone is using hotmelts with success, I would enjoy hearing of it.
Ralph Vaughan
Boeing-Atlanta
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