-----Original Message-----
        From:   Matthew Park [SMTP:[log in to unmask]]
        Sent:   Saturday, August 08, 1998 8:19 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] Gold Immersion and planarity



        Also check July 1997 & August 1998 editions of Printed Circuit
        Fabrication for OSP and electroless immersion gold/nickel
        articles.  If you don't have them, name your fax, I will try my
best to
        fax them on Monday.

        Dear Mr. M. Park ;

        Would you please forward that copy for me.
        Fax) +81-331-260-0031
         Thanks in advance.

        Tal Young-Kim
        R&D Dept.
        Doosan Electro-Materials Co., Ltd.


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