-----Original Message----- From: Matthew Park [SMTP:[log in to unmask]] Sent: Saturday, August 08, 1998 8:19 AM To: [log in to unmask] Subject: Re: [TN] Gold Immersion and planarity Also check July 1997 & August 1998 editions of Printed Circuit Fabrication for OSP and electroless immersion gold/nickel articles. If you don't have them, name your fax, I will try my best to fax them on Monday. Dear Mr. M. Park ; Would you please forward that copy for me. Fax) +81-331-260-0031 Thanks in advance. Tal Young-Kim R&D Dept. Doosan Electro-Materials Co., Ltd. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################