Hi Howard,
It depends what it is you want to be doing. MIL-STD-202F thermal cycling was
fine for hybrid assemblies or bare PCBs, but a disaster for SM assemblies,
because it was outside the temperature ranges for near linear temperature-
dependent property changes. For SM assemblies look at IPC-SM-785.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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