Hi !
We are considering some changes in our vertical ( racks ) PTH line based on
thin copper electroless . Today microetch section consists of :
1 ) microetch at following steady state operating conditions :sodium
persulfate ( 40g/l) , sulfuric acid ( 60-80 gr/l) , dissolved copper ( 12 g/l )
2 ) flowing rinse
3 ) sulfuric acid post-dip ( 100 to 200 g/l )
4 ) flowing rinse
5 ) static catalyst pre-dip
Due to lack of space in the line for some expansion I am considering
cancelation of sulfuric acid post dip and the following rinse , since
microetch solution allready has enough sulfuric acid .
All opinions ( pro , contra ) will be very appreciated.
Regards
Edward Szpruch
Eltek Ltd - Israel
Tel  972 3 9395050
Fax 972 3 9309581
E-mail :  [log in to unmask]

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