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Rick,
Another method for attaching balls is SolderQuik preforms. The solder balls
are embedded in water soluble paper. You just apply flux to the package and
drop it in a fixture with the preform. Reflow - then moisten the paper and
peel it away. The web site is at www.solderquik.com
I think what you are looking for is JEDEC Publication 95 which covers most
package dimension standards. See drawing MO-151 for the plastic ball grid
array family. Also see section 14 on BGA's. The JEDEC specs are free of
charge and available on the internet. What a great organization! Follow
the link to Publication 95 then to MO-151. http://www.jedec.org You will
need adobe acrobat to read or print the pdf file. You can get a free copy
there as well.
Hope this helps
[log in to unmask]
-----Original Message-----
From: Rick Thompson <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, August 05, 1998 11:00 AM
Subject: [TN] BGA Reballing
>I'm looking for information, recommendations, equipment, etc. for BGA
>reballing. Also, I've heard there is an IPC Spec dealing with BGA's, ball
>size, etc. Does this exist, and if so, could somebody point me in the
right
>direction.
>
> Rick Thompson
> Ventura Electronics Assembly
> 2665A Park Center Dr.
> Simi Valley, CA 93065
>
> [log in to unmask]
>
> (805) 584-9858 voice
> (805) 584-1529 fax
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