Rick,
Another method for attaching balls is SolderQuik preforms.  The solder balls
are embedded in water soluble paper.  You just apply flux to the package and
drop it in a fixture with the preform.  Reflow - then moisten the paper and
peel it away.  The web site is at  www.solderquik.com

I think what you are looking for is JEDEC Publication 95 which covers most
package dimension standards.  See drawing MO-151 for the plastic ball grid
array family.  Also see section 14 on BGA's.  The JEDEC specs are free of
charge and available on the internet.  What a great organization!  Follow
the link to Publication 95 then to MO-151.  http://www.jedec.org   You will
need adobe acrobat to read or print the pdf file.  You can get a free copy
there as well.

Hope this helps
[log in to unmask]

-----Original Message-----
From: Rick Thompson <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, August 05, 1998 11:00 AM
Subject: [TN] BGA Reballing


>I'm looking for information, recommendations, equipment, etc. for BGA
>reballing. Also, I've heard there is an IPC Spec dealing with BGA's, ball
>size, etc.  Does this exist, and if so, could somebody point me in the
right
>direction.
>
>                Rick Thompson
>                Ventura Electronics Assembly
>                2665A Park Center Dr.
>                Simi Valley, CA 93065
>
>            [log in to unmask]
>
>                (805) 584-9858 voice
>                (805) 584-1529 fax

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