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Date: | Fri, 21 Aug 1998 16:17:24 -0500 |
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Folks,
We are converting an assembly from HASL to gold that has large
quantities of 20mil devices. With HASL boards, we used a rule of thumb
of 2mil off of aperture width on these parts, 1mil on each side. Based
on the lack of pre-existing solder, should we go 1:1 on the gold board
stencil apertures? One of our engineers is recommending this, but I am
concerned about the possibility of bridging on 14mil wide pads. Our
stencils are 6mil laser cut/electropolish. Any insights would be
appreciated....
Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX 77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]
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