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August 1998

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From:
Bill Davis <[log in to unmask]>
Date:
Thu, 27 Aug 1998 07:50:05 -0700
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"\"TechNet E-Mail Forum.\" <[log in to unmask]>, Bill Davis" <[log in to unmask]>
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Try methylene chloride to remove the markings; xylene and toulene will
also remove some paints. If the parts are laser etched I'm not aware of
any chemical that will remove the etching without attacking the package.
The package material is a filled novalac resin-the filler is typically
70-90%, depending on where the parts are assembled, and silicon diox is
the filler of choice.

> *********************************
> Bill Davis, Ph.D.
> Diamond Multimedia Systems
> Senior Scientist
> Tel. 408.325.7868
> Cell. 408.888.5650
> e-mail: [log in to unmask]
> ********************************
>
>
>
> -----Original Message-----
> From: Edwin Maximo [SMTP:[log in to unmask]]
> Sent: Thursday, August 27, 1998 2:20 AM
> To:   [log in to unmask]
> Subject:      [TN] ic package
>
> Hi there!
> Can someone tell me what type of material does most IC package are
> made of. I've been looking for some ways on how can the top marking
> of ICs can be removed or covered. Any inputs will be appreciated.
> Thanks in advanced.
>
> Regards,
> Edwin Maximo
> Electronic Assemblies Inc.
> Philippines
>
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