Buried capacitance material is available from many major laminate, core,
and prepreg suppliers. There is a patent (number unknown to me) assigned
to the process and material. Several Zycon engineering personnel were
responsible for this invention. One is currently with Praegetzer as an
engineering executive (name also unknown to me) and provides technical
information about this material's use.

Simply, the material is a thin laminate with specified dielectric
thicknesses providing the required capacitance in impedance controlled
printed circuitry. At the design level, engineers and designers may
select the desired capacitance and design in the material. No special
considerations are necessary but for unique design needs. This is true
both at the design and fabrication level.

Earl Moon

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