Buried capacitance material is available from many major laminate, core, and prepreg suppliers. There is a patent (number unknown to me) assigned to the process and material. Several Zycon engineering personnel were responsible for this invention. One is currently with Praegetzer as an engineering executive (name also unknown to me) and provides technical information about this material's use. Simply, the material is a thin laminate with specified dielectric thicknesses providing the required capacitance in impedance controlled printed circuitry. At the design level, engineers and designers may select the desired capacitance and design in the material. No special considerations are necessary but for unique design needs. This is true both at the design and fabrication level. Earl Moon ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################