Hi Dick,

Personally I do not feel 5/5 technology can be produced with any kind of acceptable yield using standard panel plating techniques. I guess if a very thin base foil were to be used such as 1/4 oz or less it would improve the capability but I  have never seen it done and I'm not sure if the foil is readily available. Another concern would I would have would be the tenting of 
via holes. I would suspect that the 5/5 lines and spacing are a result of increased surface mount devices on the part. If this were the case then it would stand to reason that the hole to pad ratio would also be reduced. I really personally would be very cautious about attempting to tent as an etch resist an annular rings of .005 or less.  

Just my thoughts.

Ed Cosper

----------
From:  Dick Desrosiers[SMTP:[log in to unmask]]
Sent:  Wednesday, July 22, 1998 10:13 AM
To:  [log in to unmask]
Subject:  [TN] Plating

Technetters

 Is it possible to produce 5/5 technology with a panel plate tent and etch
 process ?  Also, what are the strengths and weaknesses of horizontal plating
processes ?  Can anyone provide me with info on horizontal electro plating ?
 Thanks for your help

Dick Desrosiers

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