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July 1998

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Subject:
From:
Joel Fillion <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Jul 1998 08:51:57 -0700
Content-Type:
text/plain
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Hello Dick,

It is definitely possible.  However, it is extremely important to properly
control plating parameters that effect plating distribution.  Also,
depending on how well you control the process, you may have to use
excessive border around the panel to isolate the circuits from your high
current density area (robbers).

Good Luck


At 11:13 AM 7/22/98 EDT, you wrote:
>Technetters
>
> Is it possible to produce 5/5 technology with a panel plate tent and etch
> process ?  Also, what are the strengths and weaknesses of horizontal plating
>processes ?  Can anyone provide me with info on horizontal electro plating ?
> Thanks for your help
>
>Dick Desrosiers
>
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