Dear all,

IPC-SM-782 shows pad width of 0.268" for 1825 chip capacitor. It's similar
to the case of the smaller packages that the pad is always a bit wider than
the component termination. However, considering the differential CTE
between the copper pad and the capacitor in the lateral direction, I worry
about the reliability. Am I over-worrying? Had anyone modified the pattern
(narrow down, perhaps) to cut down the thermal stress?

Thanks!
KK Chin
Artesyn Technologies

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