Dear all, IPC-SM-782 shows pad width of 0.268" for 1825 chip capacitor. It's similar to the case of the smaller packages that the pad is always a bit wider than the component termination. However, considering the differential CTE between the copper pad and the capacitor in the lateral direction, I worry about the reliability. Am I over-worrying? Had anyone modified the pattern (narrow down, perhaps) to cut down the thermal stress? Thanks! KK Chin Artesyn Technologies ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################