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July 1998

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Subject:
Re: Provide me your current BGA Spec on void
From:
sahmad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 13 Jul 1998 13:14:00 -0600
Content-Type:
text/plain
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text/plain (53 lines) 
Does the 10 mil spec correspond to a ball size? What about a microBGA with a
5 mil ball size?
Thanks.
Syed.

        -----Original Message-----
        From:   Ken Patel [SMTP:[log in to unmask]]
        Sent:   Friday, July 10, 1998 4:22 PM
        To:     [log in to unmask]
        Subject:        [TN] Provide me your current BGA Spec on void

        Technetters,
        What is your current spec on accepting void in BGA joints? Are you
going by
        spec of 10 mil, meaning void more than 10 mils is reject? What are
your
        customers specifying in assembly drawings?


        re,
        ken patel
        ______________________________________________________
        Ken Patel                       Phone:  (408) 490-6804
        1708 McCarthy Blvd.             Fax:    (408) 490-6859
        Milpitas, CA 95035              Beeper: (888) 769-1808

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