Coleman, Ron wrote:
>
> Bill,
>
> Controlling the thickness of OSP's is not an uncommon problem. Some OSP's
> are more difficult to control than others. The technique used to measure
> thickness is also critical to accuracy and reliability of thickness.
> Evaporation and by product reaction play biggest role in ability to control
> thickness. The type of acid medium used will also affect the solubility thus
> thickness. The product you are using has a long history of thickness control
> issues. Contact me direct if you would like to discuss in more detail
>
> Rob.
> nal Message-----
> From: Bill Davis <[log in to unmask]>
> To: [log in to unmask] <[log in to unmask]>
> Date: Monday, June 15, 1998 10:00 AM
> Subject: [TN] Entek OSP
>
> >Yo techies! Has anyone out there had experience with Ethone-OMI's Enteck
> OSP? We're using it here as we have some 0.4mm pitch devices & have had
> problems managing the thickness of the OSP. We see residues which causes
> non-weeting on the pads, & the gold edge connector still had enough OSP left
> to cause connection problems. Any help would be greatly appreciated...
> >
> >################################################################
> >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> >################################################################
> >To subscribe/unsubscribe, send a message to [log in to unmask] with following
> text in the body:
> >To subscribe:   SUBSCRIBE TechNet <your full name>
> >To unsubscribe:   SIGNOFF TechNet
> >################################################################
> >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
> information.
> >For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> >################################################################
> >
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################Bill,
Are you specifically having problems achieving proper wet out of pads and
other fine features? There is a possible relationship between the type of
flux or paste you are using with respect to solder wet out.
What pH range do you control the OSP in? This could be a factor with
thickness control.

Good luck

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################