Coleman, Ron wrote: > > Bill, > > Controlling the thickness of OSP's is not an uncommon problem. Some OSP's > are more difficult to control than others. The technique used to measure > thickness is also critical to accuracy and reliability of thickness. > Evaporation and by product reaction play biggest role in ability to control > thickness. The type of acid medium used will also affect the solubility thus > thickness. The product you are using has a long history of thickness control > issues. Contact me direct if you would like to discuss in more detail > > Rob. > nal Message----- > From: Bill Davis <[log in to unmask]> > To: [log in to unmask] <[log in to unmask]> > Date: Monday, June 15, 1998 10:00 AM > Subject: [TN] Entek OSP > > >Yo techies! Has anyone out there had experience with Ethone-OMI's Enteck > OSP? We're using it here as we have some 0.4mm pitch devices & have had > problems managing the thickness of the OSP. We see residues which causes > non-weeting on the pads, & the gold edge connector still had enough OSP left > to cause connection problems. Any help would be greatly appreciated... > > > >################################################################ > >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > >################################################################ > >To subscribe/unsubscribe, send a message to [log in to unmask] with following > text in the body: > >To subscribe: SUBSCRIBE TechNet <your full name> > >To unsubscribe: SIGNOFF TechNet > >################################################################ > >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional > information. > >For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > >################################################################ > > > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################Bill, Are you specifically having problems achieving proper wet out of pads and other fine features? There is a possible relationship between the type of flux or paste you are using with respect to solder wet out. What pH range do you control the OSP in? This could be a factor with thickness control. Good luck ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################