We sell the Solberg and Blankenhorn books that Phil mentions.  Contact me
at the SMTA for more information.

-David

At 09:10 AM 6/25/98 EDT, you wrote:
>Hi Jon -
>If you check out my website (www.ITM-SMT.com) under "Articles", you will see
>an article I did on Reflow of Through-hole (Intrusive Reflow).  Hope this
>helps.
>Regarding design guidelines for fine-pitch - I recommend Vern Solberg's
design
>guideline book as well as Jim Blankenhorn's (from SMTPlus).  But if you
have a
>solderball problem, there can be a dozen causes other than the stencil
>aperture.  Improper reflow profile, bad solder paste, are among the myriad of
>causes of solder balls.  Bridging is the same - check out the stencil design
>but be more concerned about the solder paste and printing process and printer
>parameters.
>With the MELF, there is an aperture design that is somewhat "U" shaped that
>cradles the MELF in the solder paste.  Your stencil designer should know
about
>this.
>Hope this helps.
>
>Phil Zarrow
>ITM, Inc.
>Durham, NH  USA
>www.ITM-SMT.com
>
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David Gonnerman
Director of Publications

Plan now to attend:
Surface Mount International (San Jose, CA; 8/23-8/27;
http://www.surfacemount.com)
Electronics Assembly Expo (Providence, RI; 10/24-10/29; http://www.ipc.org)

SURFACE MOUNT TECHNOLOGY ASSOCIATION
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        in surface mount and companion technologies
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