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Date: | Fri, 12 Jun 1998 07:01:40 -0700 |
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For all who will be in the San Jose, CA area Jun 25
SMTA Technical Meeting open to all
2 speakers
1) Conductive Adhesive Enabling Role in SMT and Flip Chip
Dr. Ken Gilleo, Director of Technology at Alpha Metals (Cookson)
Semiconductor Group, Rhode Island
2) Polymer Flip Chip PFC: A Technology Assessment of Solderless Bump
Processes and Reliability.
Richard H. Estes, VP of Technical Operations, Polymer Flip Chip
Corporation
Location: Sunnyvale Hilton Hotel
Champagne Room
1250 Lakeside Drive
Sunnyvale, CA 94086
(408)738-4888
Non Member with reservations $25
Non Member without reservations $30
Dinner is Chicken Teriyaki or Pasta Primavera
Reservations: Contact Amy Driban via fax at (408)321-8314 before Noon
pdt, June 22.
Abstract:
1) Conductive adhesives have long served the electronics industry as
the preferred materials for die attachment. These metal-filled
polymer-based composites have also played a key role for the ceramic
hybrid circuit industry. More recently, specially formulated products
have been used to solve problems in the printed circuit and packaging
industries. This presentation will focus on the solutions offered by
adhesives to polyester flexible circuitry, SMT assembly of
temperature-sensitive components and Flip Chip Bonding.
Polyester-based flexible circuits offer the lowest cost, the cleanest
process and simplest manufacturing of any method yet commercialized.
Hundreds of millions of low cost products have been made with
polyester by the Polymer Thick Film (PTF) process. Component assembly,
however, is only practical with low temperature conductive adhesives.
The processes will be briefly described using actual case histories.
Today, most of you are using products made with conductive adhesives.
Find out what they are!
A number of Flip Chip applications have adopted conductive adhesives
as the preferred joining material. Two significant emerging areas are
memory modules and RFID (Radio Frequency Identification) products.
Each area benefits from the unique properties offered by adhesives
compared to conventional solder. The materials, new processes and
products will be described with generous use of graphics.
2) Today Flip Chip Interconnect Technology is gaining momentum rapidly
as the microelectronics Industry strives to meet the challenges of
increasing circuit speed density and function without sacrificing size
and weight of module assemblies. Increasing the number of I/O
connections on a semiconductor device to the levels needed for the
next generation of electronic packaging will require significant
changes in circuit design, bond pad layout and the method of
interconnect used to make the electrical connections. This paper
describes the work being conducted on solderless Flip Chip bump
process technology as a method for making electrical connections
between semiconductor chips and circuit substrates. Comparisons are
made to "solder bump" Flip Chip processes, reliability and
applications data are presented on circuits fabricated with the PFC
Process. As a final topic data on Flip Chip underfill and future
applications is presented.
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