For all who will be in the San Jose, CA area Jun 25 SMTA Technical Meeting open to all 2 speakers 1) Conductive Adhesive Enabling Role in SMT and Flip Chip Dr. Ken Gilleo, Director of Technology at Alpha Metals (Cookson) Semiconductor Group, Rhode Island 2) Polymer Flip Chip PFC: A Technology Assessment of Solderless Bump Processes and Reliability. Richard H. Estes, VP of Technical Operations, Polymer Flip Chip Corporation Location: Sunnyvale Hilton Hotel Champagne Room 1250 Lakeside Drive Sunnyvale, CA 94086 (408)738-4888 Non Member with reservations $25 Non Member without reservations $30 Dinner is Chicken Teriyaki or Pasta Primavera Reservations: Contact Amy Driban via fax at (408)321-8314 before Noon pdt, June 22. Abstract: 1) Conductive adhesives have long served the electronics industry as the preferred materials for die attachment. These metal-filled polymer-based composites have also played a key role for the ceramic hybrid circuit industry. More recently, specially formulated products have been used to solve problems in the printed circuit and packaging industries. This presentation will focus on the solutions offered by adhesives to polyester flexible circuitry, SMT assembly of temperature-sensitive components and Flip Chip Bonding. Polyester-based flexible circuits offer the lowest cost, the cleanest process and simplest manufacturing of any method yet commercialized. Hundreds of millions of low cost products have been made with polyester by the Polymer Thick Film (PTF) process. Component assembly, however, is only practical with low temperature conductive adhesives. The processes will be briefly described using actual case histories. Today, most of you are using products made with conductive adhesives. Find out what they are! A number of Flip Chip applications have adopted conductive adhesives as the preferred joining material. Two significant emerging areas are memory modules and RFID (Radio Frequency Identification) products. Each area benefits from the unique properties offered by adhesives compared to conventional solder. The materials, new processes and products will be described with generous use of graphics. 2) Today Flip Chip Interconnect Technology is gaining momentum rapidly as the microelectronics Industry strives to meet the challenges of increasing circuit speed density and function without sacrificing size and weight of module assemblies. Increasing the number of I/O connections on a semiconductor device to the levels needed for the next generation of electronic packaging will require significant changes in circuit design, bond pad layout and the method of interconnect used to make the electrical connections. This paper describes the work being conducted on solderless Flip Chip bump process technology as a method for making electrical connections between semiconductor chips and circuit substrates. Comparisons are made to "solder bump" Flip Chip processes, reliability and applications data are presented on circuits fabricated with the PFC Process. As a final topic data on Flip Chip underfill and future applications is presented. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################