Sal:

In addition to my experience, I've heard reports from others that LPI locks onto residual tin.  I
can't claim that this applies to all masks, but improving the tin strip operation helped
significantly.  The only rework is to strip the mask, strip the tin, and start over.  I'm
evaluating a possible rework method but haven't had time to perform the tests.  Check with Lea
Ronal's tech service to confirm that their resist locks onto residual tin.

Don Vischulis
QA Manager
ITO Industries
[log in to unmask]

Modular Components National, Inc. wrote:

>    To All
>  We are using RONASCREEN OPSR 5600 HARDENER & RONASCREEN 5600
> OPSR 5600 CODE 2D-AU SOLDERMASK. The problem that we are having is after we
> screen the board and tack cure the board at 160 F for 30 min. We then
> expose the board then develop the board. Upon inspection of the board on
> the developed areas we have found small little areas of soldermask all over
> them if we try to develope them again they will not come off. Has anyone
> come across this before if so, how did you fix it?
> Last thing the the areas have Tin Lead on them.
>
> THANK FOR ANY IMPUT
>    SAL MITICHI
> Modular Components National, Inc.
> 2302 Industry Court
> Forest Hill, MD 2150
> PH (410) 879-6553
> Fax (410) 838-7629
>

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