We sell Klein Wassink's "Soldering in Electronics."  Let me know if you're
interested...

-David


At 08:48 AM 5/21/98 -0500, you wrote:
>Hi Frank - No, I wouldn't recommend replacing the nickel with copper.
>Copper will diffuse into/through the Ag finish creating an unsolderable
>condition after an extended amount of time. The "extended" amount of time
>will depend on the storage/use/handling conditions for the parts. You can
>find some good info in Klein Wassink's book "Soldering in Electronics" ISBN
>0-901150-14-2 on this issue. Good Luck.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>I am plating stamped 1018-Steel parts with Ni and then Ag.  I am then
>soldering them together with 2%Ag solder.  It is roughly 1" x 8".  Should I
>use Cu in place of the Ni?
>
>Frank
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
>text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
>information.
>For the technical support contact Dmitriy Sklyar at [log in to unmask] or
>847-509-9700 ext.311
>################################################################
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional
information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>################################################################
>
>
Plan now to attend:
Surface Mount International (San Jose, CA; 8/23-8/27)
Electronics Assembly Expo (Providence, RI; 10/24-10/29)

   SURFACE MOUNT TECHNOLOGY ASSOCIATION
             Enabling members to achieve success
        in surface mount and companion technologies
    through education, training and access to knowledge.

5200 Willson Road, Suite 215, Edina, MN  55424-1343
           612-920-7682  F 612-926-1819
               [log in to unmask]   www.smta.org

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################