We sell Klein Wassink's "Soldering in Electronics." Let me know if you're interested... -David At 08:48 AM 5/21/98 -0500, you wrote: >Hi Frank - No, I wouldn't recommend replacing the nickel with copper. >Copper will diffuse into/through the Ag finish creating an unsolderable >condition after an extended amount of time. The "extended" amount of time >will depend on the storage/use/handling conditions for the parts. You can >find some good info in Klein Wassink's book "Soldering in Electronics" ISBN >0-901150-14-2 on this issue. Good Luck. > >Dave Hillman >Rockwell Collins >[log in to unmask] > > > >I am plating stamped 1018-Steel parts with Ni and then Ag. I am then >soldering them together with 2%Ag solder. It is roughly 1" x 8". Should I >use Cu in place of the Ni? > >Frank > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following >text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional >information. >For the technical support contact Dmitriy Sklyar at [log in to unmask] or >847-509-9700 ext.311 >################################################################ > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 >################################################################ > > Plan now to attend: Surface Mount International (San Jose, CA; 8/23-8/27) Electronics Assembly Expo (Providence, RI; 10/24-10/29) SURFACE MOUNT TECHNOLOGY ASSOCIATION Enabling members to achieve success in surface mount and companion technologies through education, training and access to knowledge. 5200 Willson Road, Suite 215, Edina, MN 55424-1343 612-920-7682 F 612-926-1819 [log in to unmask] www.smta.org ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################