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May 1998

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Subject:
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 May 1998 21:05:06 +0300
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Gerald G. Gagnon wrote:

> Hello All
>
> I am in need of density values for:
>
> Electrolytic "hard" gold used for card edge fingers
> Electrolytic "soft" gold used for wire bonding
> Immersion gold used for solderable surface
>
> The above would reflect the deposit metallurgy typically expected for
> each end use.
>
> Thanks and regards
>
> Gerry
>
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   Gerry,
I amalso interested.Please resend any information to me too.I think that
I could use it in my XRF
appliccations.But, what do you think about the problem of different
suppliers with different bath
formulations and processes?
Bye,
Gaby

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