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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 6 May 1998 21:05:06 +0300 |
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Gerald G. Gagnon wrote:
> Hello All
>
> I am in need of density values for:
>
> Electrolytic "hard" gold used for card edge fingers
> Electrolytic "soft" gold used for wire bonding
> Immersion gold used for solderable surface
>
> The above would reflect the deposit metallurgy typically expected for
> each end use.
>
> Thanks and regards
>
> Gerry
>
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Gerry,
I amalso interested.Please resend any information to me too.I think that
I could use it in my XRF
appliccations.But, what do you think about the problem of different
suppliers with different bath
formulations and processes?
Bye,
Gaby
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