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Thu, 21 May 1998 12:13:00 -0500 |
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We sell Klein Wassink's "Soldering in Electronics." Let me know if you're
interested...
-David
At 08:48 AM 5/21/98 -0500, you wrote:
>Hi Frank - No, I wouldn't recommend replacing the nickel with copper.
>Copper will diffuse into/through the Ag finish creating an unsolderable
>condition after an extended amount of time. The "extended" amount of time
>will depend on the storage/use/handling conditions for the parts. You can
>find some good info in Klein Wassink's book "Soldering in Electronics" ISBN
>0-901150-14-2 on this issue. Good Luck.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>I am plating stamped 1018-Steel parts with Ni and then Ag. I am then
>soldering them together with 2%Ag solder. It is roughly 1" x 8". Should I
>use Cu in place of the Ni?
>
>Frank
>
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Plan now to attend:
Surface Mount International (San Jose, CA; 8/23-8/27)
Electronics Assembly Expo (Providence, RI; 10/24-10/29)
SURFACE MOUNT TECHNOLOGY ASSOCIATION
Enabling members to achieve success
in surface mount and companion technologies
through education, training and access to knowledge.
5200 Willson Road, Suite 215, Edina, MN 55424-1343
612-920-7682 F 612-926-1819
[log in to unmask] www.smta.org
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To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
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