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April 1998

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Subject:
FCC,EC and SMT pad geometries -Reply
From:
SOKKHON OU <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 13 Apr 1998 07:59:33 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines) 
It is nice reduce pad size to save space and solder. But the
disadvantage of small pads when room or space is not the saving,
bigger pads cost less during the process when misalignment still meet
IPC 610.
Thanks

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