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April 1998

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TechNet <[log in to unmask]>
Subject:
FCC,EC and SMT pad geometries -Reply
From:
SOKKHON OU <[log in to unmask]>
Date:
Mon, 13 Apr 1998 07:59:33 -0600
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"TechNet E-Mail Forum." <[log in to unmask]>, SOKKHON OU <[log in to unmask]>
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It is nice reduce pad size to save space and solder. But the
disadvantage of small pads when room or space is not the saving,
bigger pads cost less during the process when misalignment still meet
IPC 610.
Thanks

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