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April 1998

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Subject:
From:
Dave Coaker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Apr 1998 09:19:38 +0000
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John & Tom,

For our Thick Film process as well as the bumps created by printing layer 
upon layer we also use staggered vias because of vibration. Printing thru 
vias creates pillars of metal through the substrate. With excessive 
vibration these can break and open circuit those connections.

 Dave Coaker
Circuit Design Engineer
EEV Ltd - GEC Electro Optics

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