TECHNET Archives

March 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Secondary reflow during wave
From:
Jim Gryga <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 20 Mar 1998 13:21:53 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines) 
I have a board with a 208 pin QFP top side.  During the wave process the
QFP lead at its solder joint reaches 178 degrees C.  Eutectic solder
reflows at 183 degrees C so the joints should not be reaching molten state
and visual observation at least confirms that.  What is an acceptable high
end temperature for these joints to see before the joint is degraded to the
point of being a reliability risk?  Are there any empiracle tests that  can
be used to determine the degradation of the joint if any is taking place?

Jim Gryga

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################

ATOM RSS1 RSS2